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 TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module Functional Block Diagram
Vcc1 Vcc2
Features
* * * InGaP HBT Technology High Efficiency: 39% @ 28dBm Capable of running as 0-bit PA in low bias mode to 28dBm Supports new chipsets with Vref@2.6V Low Leakage Current: <1uA Optimized for 50 ohm System Small 8-pin, 3x3mm module Excellent Rx band noise performance Lead-free 260C RoHS Compliant Full ESD Protection
RF In
Input Match
Output Match
RF Out
* *
GND
Vmode
1st Stage PA
2nd Stage
* * * * *
Vref
1 bit Bias Control
GND
Product Description
The TQM713024 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for use in mobile phones. Its compact 3x3mm package makes it ideal for today's extremely small data enabled phones. Its RF performance meets the requirements for IS-95/98/CDMA2000 & WCDMA Rel99 standards. The TQM713024 is designed on TriQuint's advanced InGaP HBT GaAs technology offering state of the art reliability, temperature stability and ruggedness. Selectable bias mode and a shutdown mode with low leakage current, improve talk and standby time. The output match, realized within the module package, optimizes efficiency/linearity at maximum rated output power. The TQM713024 has robust performance into mismatch and excellent linearity margin under all operating conditions including the ability to operate in LP Mode all the way to full output power.
Applications
* * IS-95/CDMA2000 Single/Dual/Tri Mode CDMA/AMPS phones
Package Style
1 2 3 4 8 7 6 5
Electrical Specifications
Parameter Frequency CDMA mode maximum Pout1 CDMA ACPR1 (@ 885kHz Offset) CDMA ACPR2 (@ 1.98MHz Offset) PAE @ 28dBm Rx Band Noise 34 Min 824 28 -50 -60 39 -137 -46 -56 Typ Max 849 Units MHz dBm dBc dBc % dBm/Hz
8-Pin 3.0x3.0mm Plastic Module Package Top View (X-ray)
Note 1: Test Conditions CDMA Mode: VCC1=3.4VDC, VCC2=3.4VDC, VREF =2.85VDC, Tc=25C
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
1
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module Electrical Specifications
Absolute Maximum Ratings1
Parameter RF Input Power Supply Voltage Reference Voltage Vmode (1 bit Bias Control) Case Operating Temperature Storage Temperature Symbol PIN VCC VREF Vmode TCASE TSTORE Min. 0 0 0 -40 -55 Typ/Nom 0 for HPM 2 for LPM 3.4 2.85 25 25 Max. 10.0 5.0 3.5 3.5 +100 +150 Units dBm Volts Volts Volts C C
Note 1: No damage assuming only one parameter is set at a time with all other parameters set at or below nominal value.
Recommended Operating Conditions
Parameter Supply Voltage Reference Voltage PA On PA Off Vmode (1 bit Bias Control) High Bias Mode Low Bias Mode Case Operating Temperature TCASE Vmode 0 2.5 -30 2.85 25 0.5 3.0 +85 C Symbol VCC VREF 2.75 0 2.85 2.95 0.5 Volts Min. 3.2 Typ/Nom 3.4 Max. 4.2 Units Volts Volts
Note 1: No damage assuming only one parameter is set at a time with all other parameters set at or below nominal value.
Power Range Truth Table
Parameter High Power Low Power Shut Down VRef 2.85 V 2.85 V 0V Vmode Low High Low Range 16 dBm - 28 dBm < 16 dBm -
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
2
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
CDMA (IS-98C) Electrical Characteristics1,3
Parameter RF Frequency Large Signal Gain * * * * * * * * IREF ITOTAL Input VSWR PAE * * Harmonics * * 2fo 3fo 10:1 VSWR (all phases) no oscillations. All harmonic spurious 10:1 VSWR, 10dBm Pin all phases Pout +28dBm -50 -65 -40 -40 -65 No degradation in performance and no permanent damage to device dBc dBc Pout = 28dBm Pout = 16dBm Pout=+28dBm, IS-95 Standard Vcc=3.4V; Vref=2.85V; Temp=25oC 34 7 39 9 -137 -134 dBm/Hz % +16dBm Pout +28dBm Pout +16dBm (ACPR1)2 Vcc=3.4V; Vref =2.85V; -300CAdjacent Channel Power
Alternate Channel Power
Quiescent Current Vcc=3.4V; Vref=2.85V; Temp=25oC 58 110 2.5 475 1.5:1 2.0:1 4 mA mA mA
Noise Power in Rx band
Spurious/Stability Ruggedness
Note 1: Typical Test Conditions: VCC=3.4VDC, VREF=2.85VDC, TC = +25C, TriQuint Test Board. Note 2: ACPR1 measured @ 885kHz offset; ACPR2 measured @ 1.98MHz offset Note 3: Operation in LP mode to +28dBm is possible while maintaining ACPR1 specifications to improve overall efficiency Advance Data Sheet: Subject to change without notice 3
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
WCDMA Rel99 Electrical Characteristics1,3,4
Parameter RF Frequency Large Signal Gain * * * * * * * * IREF ITOTAL Input VSWR PAE * * Harmonics * * 2fo 3fo 10:1 VSWR (all phases) no oscillations. All harmonic spurious Pout +28dBm -50 -65 -40 -40 -65 dBc dBc Pout = 28dBm Pout = 16dBm Pout=+28dBm, IS-95 Standard Vcc=3.4V; Vref=2.85V; Temp=25oC 39 9 -137 -134 dBm/Hz % +16dBm Pout +28dBm Pout +16dBm (ACPR1)2 Vcc=3.4V; Vref =2.85V; -300CAdjacent Channel Power
Alternate Channel Power (ACPR2)2 Vcc=3.4V; Vref =2.85V; -300CQuiescent Current Vcc=3.4V; Vref=2.85V; Temp=25oC 58 110 2.5 475 1.5:1 2.0:1 4 mA mA mA
Noise Power in Rx band
Spurious/Stability
Note 1: Note 2: Note 3: Note 4:
Typical Test Conditions: VCC=3.4VDC, VREF=2.85VDC, TC = +25C, TriQuint Test Board ACPR1 measured @ 5 MHz offset; ACPR2 measured @ 10 MHz offset Tested under Rel99 modulation Operation to Pout=29dBm in HP mode is possible while maintaining ACPR1/ACPR2 specifications, PAE = 43%@29dBm
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
4
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module Evaluation Board
TriQuint offers our customers the below evaluation board as a means for testing and analysis of TQM713024. The evaluation board schematic and picture are provided for preliminary analysis and design. Figure 1 shows the TriQuint application board, while Figure 2 shows the schematic of the board.
1
10
Pin # 1 2 3 4
Function GND, DC Ground Vmode, High/low Bias Mode Vref, Reference Voltage Vcc1, 1st Stage Collector Voltage GND, DC Ground GND, DC Ground Vcc2, Vcc2, 2nd 2nd Stage Collector Voltage Stage Collector Voltage
IN
OUT
5 6 7 8 9 10
GND, DC Ground GND, DC Ground
Figure 1: Evaluation Board Assembly Diagram
100000 pF
10 uF VCC1
100000 pF
10 uF
TQM713024
Vcc1 RFin Vmode Vref
100000 pF 100000 pF
VCC2
Vcc2 RFOut
RF IN
RF OUT
VMODE
GND
VREF
GND
GND @ PADDLE
Figure 2: Evaluation Board Schematic
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
5
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module Packaging Characteristics
Package Pin-Out:
1 2 3 4
Top View (X-ray)
8 7 6 5
Figure 3: Package Pin-Out Identification Drawing
Note: TriQuint recommends use of several via holes to the backside ground under the Paddle.
Pin # 1 2 3 4 5 6 7 8 VCC1 RF IN VMODE VREF GND GND RF OUT VCC2
Description
Function Power supply to 1st stage of PA RF input 1-bit bias control Bias reference voltage Ground Ground RF Output Power supply to 2nd stage of PA
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
6
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
713024 YYWW XXXX
WHITE INK OR LASER MARK Line 1: 713024 (Part Number) Line 2: YYWW (Year and Work Week) Line 3: XXXX (TriQuint assembly lot number)
Figure 4: Typical Case Markings (Top View)
Recommended PC board layout to Accept 8 Pin Module Package:
Figure 5: PCB Footprint Etch Recommendations (Top View) Notes: 1.) Only ground signal traces are allowed directly under the package 2.) Primary dimensions are in millimeters alternate dimensions are in inches.
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
7
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
Packaging and Ordering Information: Package Type: 8 Pin Plastic Module Package
Figure 6: Package Drawing Information: Right (Top View) / Left (Side View) Notes: 1.) GND solder mask openings are not centered on the package
Figure 7: Package Drawing Information (Bottom View)
Figure 8: Package Marking Diagram
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
8
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
Tape and Reel Information:
Carrier Cover and Physical Tape Dimensions:
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
9
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
Reel Physical Dimensions:
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
10
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
Tape Length and Label Placement:
Label Placement:
Reel Quantity: 2,500 units
For additional information and latest specifications, see our website: www.triquint.com Revision A, July 2005
Advance Data Sheet: Subject to change without notice
11
TQM713024
Advance Data Sheet
3V GaAs HBT CDMA / WCDMA Cellular Power Amplifier Module
Additional Information 1T
1 For latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: Hwww.triquint.comH Email: info_wireless@tqs.com Tel: (503) 615-9000 Fax: (503) 615-8902
For technical questions and additional information on specific applications: Email: info_wireless@tqs.com
The information provided herein is believed to be reliable; TriQuint assumes no liability for inaccuracies or omissions. TriQuint assumes no responsibility for the use of this information, and all such information shall be entirely at the user's own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. TriQuint does not authorize or warrant any TriQuint product for use in life-support devices and/or systems. Copyright (c) 2004-5 TriQuint Semiconductor, Inc. All rights reserved.
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